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Following the introduction of the RoHS Directive and the restriction of lead in soldering materials different process parameters will be required to handle the new generation of solder alloys and board finishes. To assist those performing assembly, rework and repair operations the characteristics of RoHS compliant products have been categorised by JEDEC standards under three headings:

MSL (Moisture Sensitivity Level), PBT (Peak Body Temperature) and 2nd Level Interconnect (Terminal Finish/Material).

This vital product performance information can be obtained when using Anglia's Part Tracker service by clicking on the 'information icon' and is also included on Anglia's product labelling.

The table below explains the 2nd level interconnect classifications.

   

Terminal Finish/Material

As defined by the JEDEC standard JESD97

The following categories describe the Pb-free 2nd level interconnect terminal finish/material of components.

e1
SnAgCu (also known as SAC)
e2
Sn alloys with no Bi or Zn (excluding SnAgCu)
e3
Sn (Matte Tin)
e4
Noble/Precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)
e5
SnZn, SnZnx (no Bi)
e6
Contains Bi
e7
Low temperature solder (<150°C) containing In (no Bi)
N/A
Not applicable
Symbol definition
Ag = Silver, Au = Gold, Bi = Bismuth, Cu = Copper, In = Indium
Ni = Nickel, Pb = Lead, Pd = Palladium, Sn = Tin, Zn = Zinc

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5/1/07