Following
the introduction of the RoHS Directive and the restriction
of lead in soldering materials different process parameters will
be required to handle the new generation of solder alloys and board
finishes. To assist those performing assembly, rework and repair
operations the characteristics of RoHS compliant products have
been categorised by JEDEC standards under three headings:
MSL
(Moisture Sensitivity Level), PBT (Peak
Body Temperature) and 2nd
Level Interconnect (Terminal Finish/Material).
This
vital product performance information can be obtained when using
Anglia's Part
Tracker service
by clicking on the 'information icon' and is also included on Anglia's
product labelling.
The
table below explains the 2nd level interconnect classifications.
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Terminal
Finish/Material
As defined
by the JEDEC standard JESD97
The following
categories describe the Pb-free 2nd level interconnect terminal finish/material
of components.
e1 |
|
SnAgCu
(also known as SAC) |
e2 |
|
Sn
alloys with no Bi or Zn (excluding SnAgCu) |
e3 |
|
Sn
(Matte Tin) |
e4 |
|
Noble/Precious
metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn) |
e5 |
|
SnZn,
SnZnx (no Bi) |
e6 |
|
Contains
Bi |
e7 |
|
Low
temperature solder (<150°C) containing In (no
Bi) |
N/A |
|
Not
applicable |
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Symbol definition
Ag = Silver, Au = Gold, Bi = Bismuth, Cu = Copper, In = Indium
Ni = Nickel, Pb = Lead, Pd = Palladium, Sn = Tin, Zn = Zinc For specific enquiries, please contact RoHS@anglia.com Back to RoHS main page
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