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Intersil announces industry's smallest isolated RS-485 transceiver, now available from Anglia
Intersil has announced the industry's smallest isolated RS-485 differential bus transceiver designed to provide 4Mbps bidirectional data transmission for Industrial Internet of Things (IIoT) networks.

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Anglia receives TDK Award for Outstanding Business Performance


Anglia receives TDK Award for Outstanding Business Performance
17 July 2017
Anglia Components, a UK and Ireland distributor for TDK and EPCOS products, today announced that it has received the TDK Silver Distribution Award for Outstanding Business Performance in 2016.
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Anglia receives TDK Award for Outstanding Business Performance


Anglia receives TDK Award for Outstanding Business Performance
01 April 2017
Anglia Components, a UK and Ireland distributor for TDK and EPCOS products, today announced that it has received the TDK Silver Distribution Award for Outstanding Business Performance in 2016.
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CeraLink Capacitors from TDK offer a compact solution for converters


CeraLink Capacitors from TDK offer a compact solution for converters
19 September 2016
The CeraLink capacitor product range from TDK is a highly compact solution for the snubber and DC links of converters with special requirements with respect to space, temperature or ESL. E.g. they are ideal in connection with SiC or GaN based devices.
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Anglia expands its portfolio of multilayer power inductors with the new MLJ1608 high-performance series from TDK.


Anglia expands its portfolio of multilayer power inductors with the new MLJ1608 high-performance series from TDK.
28 June 2016
Complementing the existing MLF1608 series of multilayer power inductors for signal lines, the MLJ1608 series was designed for use in near field communication (NFC) and power line applications especially in smartphones, tablets and NFC modules.
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TDK Multilayer 0402 type Inductors with world's highest Q and reduced package size


TDK Multilayer 0402 type Inductors with world's highest Q and reduced package size
25 April 2016
TDK Corporation has announced the new MHQ0402PSA series of multilayer inductors in case size IEC 0402. Measuring in with reduced dimensions of just 0.4 mm x 0.2 mm x 0.2 mm, the new inductors feature a Q factor of 21 at 1 GHz.
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Compact SAW duplexer from EPCOS provides excellent isolation in the transmit and receive paths


Compact SAW duplexer from EPCOS provides excellent isolation in the transmit and receive paths
12 May 2015
TDK Corporation presents a new EPCOS duplexer for LTE Band 1, which at 60 dB features very high isolation for both the Tx and Rx paths. Based on SAW technology the B8651 duplexer has a miniature footprint of just 1.8 mm x 1.4 mm.
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TDK offering wide range of compact low profile SMD Power Inductors


TDK offering wide range of compact low profile SMD Power Inductors
10 April 2015
TDK offer a wide range of surface mount power inductors designed for the most demanding applications. Some of the most recent introductions the VLF-M, VLS-E and VLS-HBX-1 series offer compact sizes and include low profile models and high current ratings.
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CeraLink Capacitors from EPCOS provide a compact solution for converters


CeraLink Capacitors from EPCOS provide a compact solution for converters
12 March 2015
TDK Corporation presents a new generation of the EPCOS CeraLink, a highly compact solution for the snubber and DC links of fast-switching converters based on SiC and GaN semiconductors.
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New series of ultra-compact EPCOS µDC-DC converters is available


New series of ultra-compact EPCOS µDC-DC converters is available
03 March 2015
The ultra-compact µDC-DC converters feature a footprint of only 2.9 mm x 2.3 mm and an insertion height of 1 mm. One 6-MHz power switch is embedded in the miniature PCB.
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TDK SMT current sense transformers for automotive electronics


TDK SMT current sense transformers for automotive electronics
02 February 2015
TDK has introduced two new SMT current sense transformers for automotive electronics. The SMT current sense transformers are designed for use in emerging 48-V automotive power systems as well as for all xEV applications.
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TDK introduces the new ACT1210 series of common-mode chokes for both CAN and FlexRay bus systems


TDK introduces the new ACT1210 series of common-mode chokes for both CAN and FlexRay bus systems
18 December 2014
With dimensions of just 3.2mm x 2.5mm x 2.4mm, the chokes are the extremely compact. Their footprint is approximately 45 percent smaller than that of existing components, while their volume has been more than cut in half.
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RF components industry's smallest multilayer diplexer from TDK


RF components industry's smallest multilayer diplexer from TDK
07 November 2014
TDK Corporation has developed a new multilayer diplexer in case size IEC 1005 for the implementation of 2.4 GHz/5 GHz band WLAN in smartphones and other mobile devices.
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TDK's miniature chip varistor with BGA terminals offers 33% saving in board mounting area


TDK's miniature chip varistor with BGA terminals offers 33% saving in board mounting area
11 October 2008
TDK Electronics Europe has introduced the AVF26BA12A400R201, a miniature chip varistor that uses a Ball Grid Array (BGA) terminal arrangement to reduce board mounting area by 33%.
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New ceramic chip capacitors from TDK offer highest capacitance for 100V applications


New ceramic chip capacitors from TDK offer highest capacitance for 100V applications
11 October 2008
TDK Electronics Europe has announced the introduction of a new generation of 100V-rated ceramic chip capacitors that offers the industry’s highest level of capacitance for mid-voltage applications in devices half the size of their predecessors.
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New chip inductors from TDK offer best impedance in a 1005 device


New chip inductors from TDK offer best impedance in a 1005 device
11 October 2008
TDK Electronics Europe has announced the MMZ1005-E series, a family of three Gigaspira multilayer gigahertz-band chip bead inductors offering the world’s highest impedance in a 1005-size device.
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Articles 1 to 15 of 15

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